ISO 9001: 2000 Registered MIL-PRF-31032 MIL-PRF-55110

NASA Approved  MIL-P-50884 IPC-6012, 6013

Qualifications and Approvals ISO 9001: 2000 REGISTERED Registration No. FM 21686 Qualified Products Listed - Military Specifications MIL-PRF-55110 (GF, GI, BI Products) MIL-P-50884 (Adhesiveless Flex and Rigid-Flex Products) NASA-STD-8739.3 MIL-STD-2000 MIL-STD-1547B (USAF) WS-6536 ELV (Expendable Launch Vehicle) UL File No. E11997 (N) FR4 Multifunctional Epoxy and High Temperature Polyimide Flex Circuits Rigid-Flex Circuits Teflon® Bonded Heatsinks Core PCB's CIC CMC Aluminum Heavy Copper Thermount® (non-woven aramid)

Rigid PCB's Multifunctional - FR4 (Tg 140°C) Modified Epoxy - FR4 (Tg 160°C to 210°C) Polyimide (Tg 260°C) = High Temperature PTFE - Teflon® = High Speed (RF, Microwave) G-TEK® - FR4 Processable, Higher Speed, Lower Dk, Df than FR4 Polyimide Thermount® (Random Aramid Fiber) = High Temperature, Low X, Y CTE Epoxy Thermount® (Random Aramid Fiber)=Low X, Y CTE - Less Hygroscopic Flex & Rigid-Flex PCB's All Polyimide, Cast Adhesiveless Kapton® (preferred) Polyimide Kapton® with Acrylic Adhesive Complete Polyimide Builds FR4, Polyimide Builds Meet CTE & Thermal Requirements by Incorporating: CIC Cores (Copper-Invar-Copper) CMC Cores (Copper-Moly-Copper) Heavy Copper, Copper, Aluminum Cores Bonded Heatsinks Application Specific Adhesives Thermagon® = Thermally Conductive Cores & Prepregs Thermabond® = Decoupling, Thermally Conductive Adhesive                        (Heatsink CTE Management) Sovereign Circuits offers a wide range of technology to address the "application specific" needs of our customers. In addition we offer these services in both quick-turn prototype and scheduled production lead times.

Board Features Minimum Conductor Width* Minimum Conductor Spacing* Minimum Hole Size Before Plating** Maximum Hole Size After Plating Maximum Hole Size Non-Plating Hole Aspect Ratio Maximum Active Board Size Maximum Cu Foil Thickness                    Outer Layers                    Inner Layers Board Thickness Tolerance

0.004" 0.004" 0.011" Unlimited Unlimited 7:1 20" x 22.5" 21" x 24" 4 oz. 6 oz. +/-10%

·   Blind Vias ·   Buried Vias ·   Controlled Impedence H.T.E. (High Temperature Elongation) Copper Foils High Elongation Plated Copper > 14% *Dependant on copper Weight ** Dependant on hole to aspect ratio Board Finishes Solder Mask Over Bare Copper (hot air solder leveling) Immersion Tin Immersion Gold Gold Over Copper Gold Over Nickel Over Copper Gold Over Palladium Over Nickel Selective Gold Hard and Soft Gold Tin Over Nickel Solder Mask Dry Film Mask (3 or 4 mils) Morton ® Conformask Liquid Photo Imageable Various Colors